98 lines
2.0 KiB
Plaintext
98 lines
2.0 KiB
Plaintext
{
|
|
"Header": {
|
|
"GenerationSoftware": {
|
|
"Vendor": "KiCad",
|
|
"Application": "Pcbnew",
|
|
"Version": "8.0.4"
|
|
},
|
|
"CreationDate": "2024-09-07T09:02:32+02:00"
|
|
},
|
|
"GeneralSpecs": {
|
|
"ProjectId": {
|
|
"Name": "chairAdjust-relayBoard",
|
|
"GUID": "63686169-7241-4646-9a75-73742d72656c",
|
|
"Revision": "rev?"
|
|
},
|
|
"Size": {
|
|
"X": 101.015,
|
|
"Y": 78.79
|
|
},
|
|
"LayerNumber": 2,
|
|
"BoardThickness": 1.6,
|
|
"Finish": "None"
|
|
},
|
|
"DesignRules": [
|
|
{
|
|
"Layers": "Outer",
|
|
"PadToPad": 0.2,
|
|
"PadToTrack": 0.2,
|
|
"TrackToTrack": 0.2,
|
|
"MinLineWidth": 1.0,
|
|
"TrackToRegion": 0.8,
|
|
"RegionToRegion": 0.8
|
|
}
|
|
],
|
|
"FilesAttributes": [
|
|
{
|
|
"Path": "chairAdjust-relayBoard-F_Cu.gbr",
|
|
"FileFunction": "Copper,L1,Top",
|
|
"FilePolarity": "Positive"
|
|
},
|
|
{
|
|
"Path": "chairAdjust-relayBoard-B_Cu.gbr",
|
|
"FileFunction": "Copper,L2,Bot",
|
|
"FilePolarity": "Positive"
|
|
},
|
|
{
|
|
"Path": "chairAdjust-relayBoard-Edge_Cuts.gbr",
|
|
"FileFunction": "Profile",
|
|
"FilePolarity": "Positive"
|
|
}
|
|
],
|
|
"MaterialStackup": [
|
|
{
|
|
"Type": "Legend",
|
|
"Name": "Top Silk Screen"
|
|
},
|
|
{
|
|
"Type": "SolderPaste",
|
|
"Name": "Top Solder Paste"
|
|
},
|
|
{
|
|
"Type": "SolderMask",
|
|
"Thickness": 0.01,
|
|
"Name": "Top Solder Mask"
|
|
},
|
|
{
|
|
"Type": "Copper",
|
|
"Thickness": 0.035,
|
|
"Name": "F.Cu"
|
|
},
|
|
{
|
|
"Type": "Dielectric",
|
|
"Thickness": 1.51,
|
|
"Material": "FR4",
|
|
"Name": "F.Cu/B.Cu",
|
|
"Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)"
|
|
},
|
|
{
|
|
"Type": "Copper",
|
|
"Thickness": 0.035,
|
|
"Name": "B.Cu"
|
|
},
|
|
{
|
|
"Type": "SolderMask",
|
|
"Thickness": 0.01,
|
|
"Name": "Bottom Solder Mask"
|
|
},
|
|
{
|
|
"Type": "SolderPaste",
|
|
"Name": "Bottom Solder Paste"
|
|
},
|
|
{
|
|
"Type": "Legend",
|
|
"Name": "Bottom Silk Screen"
|
|
}
|
|
]
|
|
}
|